JPH0410670Y2 - - Google Patents
Info
- Publication number
- JPH0410670Y2 JPH0410670Y2 JP9874688U JP9874688U JPH0410670Y2 JP H0410670 Y2 JPH0410670 Y2 JP H0410670Y2 JP 9874688 U JP9874688 U JP 9874688U JP 9874688 U JP9874688 U JP 9874688U JP H0410670 Y2 JPH0410670 Y2 JP H0410670Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electrode layer
- glass frit
- solderability
- weight percent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 29
- 239000003985 ceramic capacitor Substances 0.000 description 12
- 238000005476 soldering Methods 0.000 description 11
- 239000003973 paint Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9874688U JPH0410670Y2 (en]) | 1988-07-26 | 1988-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9874688U JPH0410670Y2 (en]) | 1988-07-26 | 1988-07-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0220319U JPH0220319U (en]) | 1990-02-09 |
| JPH0410670Y2 true JPH0410670Y2 (en]) | 1992-03-17 |
Family
ID=31325280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9874688U Expired JPH0410670Y2 (en]) | 1988-07-26 | 1988-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410670Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346322A (zh) * | 2018-10-17 | 2019-02-15 | 成都宏明电子科大新材料有限公司 | 一种脉冲功率陶瓷电容器、端电极及制备方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3760770B2 (ja) * | 2001-01-05 | 2006-03-29 | 株式会社村田製作所 | 積層セラミック電子部品及びその製造方法 |
-
1988
- 1988-07-26 JP JP9874688U patent/JPH0410670Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346322A (zh) * | 2018-10-17 | 2019-02-15 | 成都宏明电子科大新材料有限公司 | 一种脉冲功率陶瓷电容器、端电极及制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0220319U (en]) | 1990-02-09 |
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